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SZ PUFENG PACKING MATERIAL LIMITED
SHENZHEN PUFENG PACKING MATERIAL CO.,LTD SZ PUFENG PACKING MATERIAL LIMITED
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Bergquist Gap VO Thermal Conductive Pad Silicon Film CPU Power Supply Flame

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City: Shenzhen
Province/State: Guangdong
Country/Region: China

Bergquist Gap VO Thermal Conductive Pad Silicon Film CPU Power Supply Flame

Bergquist Gap VO Thermal Conductive Pad Silicon Film CPU Power Supply Flame

Bergquist Gap Pad VO Thermal silicon film CPU power supply flame retardant Product features/Applications: Thermal conductivity: 0.8 W/m-K,electrically isolating Enhanced puncture, shear and tear ...

Product Tags:

Gap thermal conductive pad

      

VO thermal conductive pad

      

CPU thermal conductive pad

      
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