Sign In | Join Free | My frbiz.com
China SZ PUFENG PACKING MATERIAL LIMITED logo
SZ PUFENG PACKING MATERIAL LIMITED
SHENZHEN PUFENG PACKING MATERIAL CO.,LTD SZ PUFENG PACKING MATERIAL LIMITED
Verified Supplier

7 Years

Home > Thermal Conductive Pad >

Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad

SZ PUFENG PACKING MATERIAL LIMITED
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
SZ PUFENG PACKING MATERIAL LIMITED
Visit Website
City: Shenzhen
Province/State: Guangdong
Country/Region: China

Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad

Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad

Bergquist Gap Pad 3500ULM 3.5W/m-K High quality CPU thermally conductive pad Product description : BERGQUIST Gap Pad 3500ULM, also known as Henkel BERGQUIST GAP PAD TGP 350ULM, is an excellent thermal ...

Send your message to this supplier
 
*From:
*To: SZ PUFENG PACKING MATERIAL LIMITED
*Subject:
*Message:
Characters Remaining: (0/3000)