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SZ PUFENG PACKING MATERIAL LIMITED
SHENZHEN PUFENG PACKING MATERIAL CO.,LTD SZ PUFENG PACKING MATERIAL LIMITED
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3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting

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3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting

3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting

3W/m·K high thermal conductivity electronic components heat conduction plate Product features/Applications: High cost performance, high thermal conductivity, low thermal resistance. High adherence, ...

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